TSMC Reports Record Quarterly Profit, Expects Strong Growth in Early 2025

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Taiwan Semiconductor Manufacturing Co (TSMC) has posted a record-breaking quarterly profit, reporting a 57% increase in net income to T$374.68 billion ($11.4 billion) for the quarter ending Dec. 31. This surge in profit aligns with the company’s bullish outlook for the future, as revenue jumped by 39% compared to the same period last year. TSMC has forecasted continued strong performance, with a revenue growth estimate of about 37% for the first quarter of 2025, projecting earnings between $25-25.8 billion. For the full year, TSMC expects revenue growth to be between 20% and 30%, driven largely by the demand for chips used in artificial intelligence (AI) processing.

While TSMC’s business is thriving, it faces challenges stemming from U.S. government restrictions on AI chip exports to China. The Biden administration recently announced further curbs on these exports, which could affect demand from clients. However, TSMC’s CEO, C.C. Wei, expressed confidence that the company could manage these restrictions, stating that they are currently applying for special permits for affected clients and anticipating approval. He also emphasized the company’s strong communication with both the current and incoming U.S. administrations.

TSMC’s growth is also supported by its ambitious expansion plans, including new fabs in the United States, Japan, Germany, and Taiwan. For 2025, TSMC has set its capital spending target between $38 billion and $42 billion, marking a potential 41% increase. The AI-driven boom has significantly boosted TSMC’s stock price, which surged 81% in 2024, outperforming the broader market’s 28.5% growth.

 

iGenius to Complete $1B Data Centre Project with Nvidia by Summer

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Italian AI startup iGenius is on track to complete a $1 billion data centre project in southern Italy by the summer, utilizing Nvidia technology. The project, which will span five years, has prompted the company to extend its funding round from an initial target of 650 million euros. CEO Uljan Sharka shared that the new supercomputer built for the data centre will perform at an extraordinary rate, capable of executing 115 billion calculations per second. This marks a significant leap from Europe’s previous top supercomputers, which could handle only 0.5 billion calculations per second until last year.

The data centre will be powered by Nvidia’s advanced Blackwell chips, providing 35 times more computing power than their predecessors, while using 25 times less energy. The facility will house 80 of Nvidia’s most powerful servers, each containing 72 Blackwell chips. Southern Italy was chosen as the site for the project due to its surplus of renewable energy capacity, which will help meet the high power demands of the supercomputing operation.

iGenius, founded in 2016, is one of the few AI startups in Europe valued at over $1 billion, competing with other industry players such as France’s Mistral and Germany’s DeepL. The company recently launched Colosseum 355B, a large language model designed specifically for industries with stringent data protection needs, including finance, heavy industry, and government sectors. iGenius differentiates itself from competitors like OpenAI by providing open-source AI models for companies to run on their own infrastructure, allowing for greater control over sensitive data.

 

Nvidia Shifts Focus to New Advanced Packaging Technology

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Nvidia’s CEO Jensen Huang confirmed that while the company’s demand for advanced packaging from TSMC remains robust, the specific type of technology required is evolving. At an event in Taichung, Taiwan, Huang explained that Nvidia is transitioning its focus from CoWoS-S to CoWoS-L for its upcoming Blackwell AI chips. This shift, however, does not signal a reduction in capacity, but rather an increase in the use of CoWoS-L, a newer, more advanced version of TSMC’s chip packaging technology.

Nvidia had previously relied heavily on CoWoS-S for its AI chips, including the Hopper platform. As the company moves into Blackwell, which was unveiled in March 2024, it plans to transition existing CoWoS-S capacity to CoWoS-L. This change will impact TSMC’s supply chain but is seen as a step forward in Nvidia’s push to meet the growing demand for its AI chips.

Huang also noted that while packaging capacity for these advanced chips had previously been a bottleneck, it had expanded significantly in recent years, with available capacity now approximately four times greater than it was two years ago. Despite the increased demand, Nvidia has not been cutting orders but is instead increasing its reliance on CoWoS-L, which is expected to better meet the needs of Blackwell’s design.

The move to CoWoS-L technology and changes in Nvidia’s order patterns have sparked speculation about the potential impact on TSMC’s revenue, particularly with analysts like Ming-Chi Kuo noting the shift in Nvidia’s focus. Huang declined to comment on recent U.S. export restrictions that limit AI chip sales to countries outside a select group of U.S. allies, but the company’s strategies continue to evolve in response to market demands and geopolitical factors.