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Samsung Galaxy Z Flip 7 May Feature Exynos 2500 SoC, Chip Specs Leaked

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Samsung recently launched the Galaxy S25 series, exclusively powered by the Snapdragon 8 Elite for Galaxy chipset, marking a break from its usual strategy of mixing Qualcomm and in-house Exynos chips. However, the South Korean tech giant appears to be making a shift with its upcoming foldable lineup. Reports now suggest that Samsung is preparing to equip the Galaxy Z Flip 7 with the Exynos 2500 chipset, moving away from its long-standing reliance on Snapdragon processors for foldable devices. The clamshell-style foldable is expected to debut in the second half of this year, but ahead of its launch, detailed specifications of the Exynos 2500 have surfaced online.

A well-known tipster, @Jukanlosreve, recently claimed on X (formerly Twitter) that the Galaxy Z Flip 7 will be powered by Samsung’s unannounced Exynos 2500 SoC. If true, this would mark a major shift in Samsung’s approach to its foldable devices, as the company has exclusively used Snapdragon processors in its Z Flip series since its inception. The decision to use an Exynos chipset could signal Samsung’s confidence in its latest in-house silicon, potentially offering improvements in efficiency, AI capabilities, and battery life.

Until now, Samsung’s foldable devices have consistently been equipped with Snapdragon processors. The Galaxy Z Flip 6 and Galaxy Z Fold 6, which are set to launch later this year, are expected to feature the Snapdragon 8 Gen 3 Mobile Platform for Galaxy. Similarly, last year’s Galaxy Z Flip 5 and Galaxy Z Fold 5 were powered by the Snapdragon 8 Gen 2 Mobile Platform for Galaxy. The move to an Exynos chip in the upcoming Z Flip 7, if confirmed, could indicate a broader strategy to integrate Samsung’s own processors into more of its premium devices.

With months to go before the official unveiling of the Galaxy Z Flip 7, leaks and rumors will likely continue to shed light on Samsung’s plans. If the Exynos 2500 does make its way into the foldable lineup, it will be interesting to see how it stacks up against Qualcomm’s latest offerings in terms of performance, thermal efficiency, and overall user experience. As Samsung refines its hardware strategy, the decision to reintroduce Exynos chips in foldable phones could have significant implications for the future of its premium smartphone lineup.

OpenAI Partners with Kakao and Explores Stargate Project with SoftBank and Samsung

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OpenAI has announced a significant partnership with South Korea’s Kakao, marking a second high-profile alliance in Asia this week. The collaboration will focus on developing artificial intelligence products tailored for the South Korean market. Kakao, known for operating the popular messaging app KakaoTalk, which holds 97% of the local market share, is keen on leveraging OpenAI’s technology to fuel its expansion into AI, e-commerce, payments, and gaming. Despite its efforts, analysts note Kakao has lagged behind local rival Naver in the AI sector.

OpenAI’s CEO, Sam Altman, who is currently on a tour of Asia, also met with executives from Samsung Electronics, SoftBank, and Arm Holdings in Seoul. Discussions centered around the Stargate project, an AI data centre initiative in the U.S. that is supported by U.S. President Donald Trump. SoftBank’s Masayoshi Son confirmed that potential cooperation between SoftBank, Samsung, and OpenAI regarding Stargate was discussed, though no specific details were shared. Altman declined to comment on the partnership talks, emphasizing the need for confidentiality.

The Stargate initiative aims to enhance AI capabilities in the U.S. through a collaboration between OpenAI and Oracle. Altman mentioned that several South Korean companies, particularly those in energy, semiconductors, and the internet, would play a crucial role in supporting the project. Furthermore, discussions were held with SK Group’s chairman, Chey Tae-won, regarding potential collaborations in AI chips and the broader AI ecosystem, with both Samsung and SK Hynix producing essential memory chips for AI processors.

OpenAI is also actively considering involvement in South Korea’s national AI computing centre project, which is expected to attract up to 2 trillion won ($1.4 billion) in public and private investment. This marks a continued push by OpenAI to expand its presence in Asia and solidify partnerships with major players in the region.

Following the announcement, Kakao’s stock fell by 2%, reversing the 9% surge it experienced the previous day.

 

Samsung Faces AI Chip Sales Slowdown Amid U.S. Export Restrictions

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Samsung Electronics warned on Friday that its AI chip sales will be sluggish in the first quarter due to U.S. export restrictions on China, as well as a shift in demand toward more advanced chips. The company is working to launch an improved version of its high-bandwidth memory (HBM) chips in March to address these challenges.

Samsung’s struggles are compounded by its reliance on Chinese customers, who accounted for about 20% of its HBM sales. The U.S. government’s expanded restrictions on semiconductor exports have put additional pressure on the company, unlike its competitor SK Hynix, which remains Nvidia’s primary supplier of HBM chips for AI applications.

Kim Jae-june, Samsung’s executive vice president of memory, acknowledged that “temporary restrictions” would impact HBM sales but expressed optimism about future improvements. Meanwhile, Nvidia CEO Jensen Huang recently indicated that Samsung needs to “engineer a new design” to meet Nvidia’s standards.

Despite these efforts, Samsung reported a 29% decline in operating profit for Q4, totaling 6.5 trillion won ($4.48 billion). The company also faces headwinds in the mobile market, where competition from Apple and Chinese rivals has eroded profits. Samsung’s decision to use Qualcomm processors for its entire Galaxy S25 lineup, instead of its in-house Exynos chips, represents another setback for its semiconductor division.

While AI-driven demand for memory chips is expected to recover from Q2 onward, Samsung’s long-term performance will depend on its ability to mass-produce advanced 12-layer HBM3E chips for Nvidia.