HMD Fusion 2 Leaks Reveal Snapdragon 6s Gen 4, Smart Outfit Feature, and Other Specs
HMD is preparing to unveil its next modular smartphone, the HMD Fusion 2, as a successor to the recently launched HMD Fusion in India. Early leaks have revealed several notable upgrades, including the second-generation Smart Outfits system and the latest Qualcomm Snapdragon 6s Gen 4 processor. The Fusion 2 promises to expand on the modular concept introduced with the original model, offering new ways to customize the device for different uses.
According to tips shared by HMD Meme on X, the HMD Fusion 2 will feature Smart Outfits Gen 2 with Pogo Pin 2.0, allowing users to attach a variety of modular accessories through six smart pins. The lineup is expected to include innovative options like a Casual Outfit with a Kickstand, Wireless Charging Outfit, Rugged Outfit, Gaming Outfit, Camera Grip Outfit, Flashy Outfit, Speaker Outfit, QR and Barcode Outfit, and even a Smart Projector Outfit. These new modules, however, will not be compatible with the first-generation Fusion.
In terms of hardware, the Fusion 2 is said to come with a 6.58-inch OLED display with Full HD+ resolution and a 120Hz refresh rate. The device will run on the Snapdragon 6s Gen 4 chipset, delivering improved performance and efficiency. Photography enthusiasts can expect a dual-camera setup on the rear, featuring a 108-megapixel primary sensor with OIS support and an 8-megapixel ultra-wide-angle lens.
Other reported features include IP65 water resistance, Bluetooth 5.3, dual stereo speakers, and a 3.5mm headphone jack, keeping some traditional connectivity options intact. While the specifications suggest a substantial upgrade over the original Fusion, the launch date of the HMD Fusion 2 has not yet been announced, leaving fans eagerly anticipating further official details.



