Broadcom Targets 3D Chip Sales

Broadcom expects to sell at least one million advanced stacked chips by 2027, signaling a major step forward in its AI hardware strategy.

The company’s technology combines multiple silicon layers into a single integrated unit, improving performance and energy efficiency for high-demand computing tasks.

Early engineering samples are already being tested by partners, with broader production planned in the coming years. The design enables greater data flow between components, supporting increasingly complex AI workloads.

Broadcom’s approach also allows flexibility in manufacturing processes, helping customers tailor chip performance to specific needs.

The initiative is expected to open a substantial new revenue stream while strengthening the company’s position in the competitive AI semiconductor landscape.