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US Lawmakers Urge Tighter Curbs on China Chip Tools

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U.S. lawmakers are pressing for stricter export controls to limit China’s access to advanced semiconductor manufacturing equipment, warning that existing gaps pose risks to national security. In a bipartisan letter, senior members of the House called on the State and Commerce Departments to pursue broader, countrywide restrictions in coordination with allied nations.

House Select Committee on China Chairman John Moolenaar and House Foreign Affairs Committee Chairman Brian Mast urged tighter controls on key chipmaking tools and subcomponents that China cannot produce domestically. The letter was addressed to Secretary of State Marco Rubio and Commerce Secretary Howard Lutnick, and called for restrictions not only on new equipment sales but also on servicing existing tools operating in Chinese facilities.

Lawmakers argue that maintenance and software updates are critical for advanced chipmaking systems to remain operational, and limiting such support could slow China’s semiconductor progress. The request comes amid concerns that Beijing is accelerating imports of foreign-made equipment essential for producing high-end chips.

The debate has intensified following reports that Chinese researchers have developed a prototype lithography machine modeled on extreme ultraviolet systems produced by ASML. EUV lithography tools are considered crucial for manufacturing the most advanced chips used in artificial intelligence, smartphones, and defense systems.

Congressional leaders have asked the administration to provide a strategy briefing within a month outlining how it plans to secure allied cooperation on expanded export controls. The move reflects growing bipartisan consensus in Washington that semiconductor supply chains remain a central front in U.S.–China technological competition.

Japan’s JIC Reaffirms Chip Sector Consolidation Plans Despite JSR Losses

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Japan Investment Corporation (JIC), the state-backed investment fund, remains committed to its long-term goal of driving consolidation in Japan’s semiconductor materials sector through its portfolio company JSR, despite the firm’s recent financial struggles.

JSR, a leading photoresist manufacturer, ended the fiscal year in March with a 209 billion yen ($1.45 billion) operating loss, primarily due to its underperforming life sciences division. Nevertheless, JIC Capital CEO Shogo Ikeuchi emphasized in a recent interview that the strategic intent behind JIC’s $6 billion buyout of JSR last year remains unchanged.

“Our goal was to take JSR private and… through a series of industry reorganizations, such as mergers with similar companies or rivals… to significantly grow the semiconductor business and enhance international competitiveness,” Ikeuchi said. “That goal hasn’t really changed at all even now.”

JSR has since restructured its leadership and is undergoing a strategic overhaul. While its new CEO recently stated that the company isn’t ready to pursue acquisitions yet, JSR has agreed to sell part of its life sciences unit to Tokuyama Corp in an 82 billion yen deal, a move aimed at focusing on its core chipmaking business.

JIC’s involvement in JSR has faced some criticism in Japan’s traditionally conservative corporate environment, with skeptics questioning the necessity and potential of such state-led intervention. Ikeuchi acknowledged these concerns, stating, “Japan is a country where restructuring is structurally difficult.”

Despite these hurdles, JIC maintains its goal of eventually re-listing JSR, likely within five to seven years, though an earlier IPO is not ruled out.

Industry players are already expressing interest in potential partnerships or acquisitions. Resonac, another major player in chip materials, said in February it would be interested in JSR when JIC eventually exits. Ikeuchi confirmed Resonac as one of the options, though noted its current debt burden as a limiting factor.

JIC, created in 2018 under the oversight of Japan’s trade ministry, aims to strengthen Japan’s industrial competitiveness — with semiconductor self-reliance a national priority amid global supply chain tensions.

TSMC Proposes Joint Venture with Intel’s Foundry Division to Nvidia, AMD, and Broadcom

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TSMC (2330.TW) has pitched the idea of a joint venture involving Intel’s (INTC.O) foundry division to major U.S. chip designers, including Nvidia (NVDA.O), Advanced Micro Devices (AMD.O), and Broadcom (AVGO.O), according to sources familiar with the discussions. Under the proposal, TSMC, the world’s leading contract chipmaker, would oversee Intel’s foundry operations, which focus on manufacturing chips tailored to customer needs, but TSMC would retain no more than 50% ownership.

The proposal has been discussed with several other firms as well, including Qualcomm (QCOM.O), as part of TSMC’s efforts to partner with chip designers. The discussions are still in their early stages, and any potential deal would require approval from the U.S. government, particularly under the administration of President Donald Trump, who has shown interest in helping Intel recover from its financial struggles. Trump is particularly invested in boosting American manufacturing and supporting companies like Intel in remaining U.S.-owned.

Intel, which reported an $18.8 billion net loss for 2024, has seen a drastic decline in its stock price over the past year. As of December 31, the book value of Intel’s foundry division’s property and plant equipment stood at $108 billion. The company’s recent struggles have pushed its board members to consider various strategic moves, including partnering with TSMC for its foundry operations.

Despite some internal opposition, Intel’s board members have expressed support for exploring a joint venture with TSMC, with Intel’s executives holding different views on the matter. Intel’s foundry division, once a crucial part of Intel’s strategy under former CEO Pat Gelsinger, is now central to the company’s efforts to return to profitability, even as Gelsinger was replaced by interim co-CEOs in December.

TSMC’s push for a joint venture is complicated by the significant differences in manufacturing processes and technologies between the two companies. Intel and TSMC currently employ distinct chipmaking methods, which could pose challenges in aligning operations. Intel has previously partnered with Taiwan’s UMC (2303.TW) and Israel’s Tower Semiconductor (TSEM.TA), offering some precedent for potential collaboration, but the specifics of how such a partnership could function remain uncertain, especially regarding the sharing of trade secrets.

While TSMC’s interest is to involve Intel’s advanced manufacturing customers in the venture, discussions have also centered around Intel’s 18A manufacturing process, a key area of contention in the negotiations. Intel executives have claimed that its 18A technology surpasses TSMC’s 2-nanometer process, with Nvidia and Broadcom already testing Intel’s manufacturing capabilities, alongside AMD exploring the potential of Intel’s processes for its chips.