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Intel Reshuffles Top Leadership as Products Chief Holthaus Departs

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Intel (INTC.O) announced a major executive shake-up on Monday, including the departure of Michelle Johnston Holthaus, the company’s products chief, as CEO Lip-Bu Tan moves to streamline operations and push a turnaround strategy.

Holthaus, a 30-year Intel veteran, previously held several senior leadership positions, including serving as interim co-CEO following the ouster of Pat Gelsinger in 2024. She will step down but remain as a strategic adviser in the coming months.

The restructuring includes:

  • Kevork Kechichian joining as EVP and head of the Data Center Group. Kechichian is a seasoned industry leader who previously held senior roles at Arm, NXP Semiconductors, and Qualcomm.

  • A new Central Engineering Group, to be led by Srinivasan Iyengar, tasked with building a custom silicon business for external clients.

  • Naga Chandrasekaran, Intel EVP and CTO, expanding his remit to oversee Foundry Services.

  • Jim Johnson appointed as GM of Intel’s Client Computing Group.

The leadership reshuffle comes as Intel grapples with a difficult business environment and political pressure. U.S. President Donald Trump recently announced plans for the government to take a 10% stake in Intel, while also calling for CEO Tan’s resignation over alleged conflicts of interest.

Tan’s strategy aims to flatten Intel’s leadership structure, cut jobs, and restore competitiveness as the company struggles to keep pace with rivals in advanced chipmaking.

OpenAI to Debut First AI Chip in 2026 With Broadcom Partnership

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OpenAI will launch its first in-house artificial intelligence chip in 2026 through a partnership with U.S. semiconductor leader Broadcom (AVGO.O), according to the Financial Times. The chip will be used internally to power OpenAI’s own AI systems rather than being sold to external customers, people familiar with the matter said.

The move reflects OpenAI’s push to diversify away from Nvidia, whose GPUs currently dominate AI computing, and to lower infrastructure costs amid surging demand for training and running large-scale AI models like ChatGPT. OpenAI has previously collaborated with Broadcom and Taiwan Semiconductor Manufacturing Co. (TSMC) on design and fabrication, while also supplementing with AMD and Nvidia chips.

Reuters earlier reported that OpenAI was finalizing the design of its first custom silicon, to be manufactured at TSMC, with a focus on reducing reliance on outside suppliers. By developing its own chip, OpenAI joins rivals Google, Amazon, and Meta, which have already rolled out proprietary processors to handle escalating AI workloads.

The timing of the news coincides with Broadcom CEO Hock Tan’s announcement on Thursday that the company had secured over $10 billion in AI infrastructure orders from a new unnamed customer, set to drive significant revenue growth in fiscal 2026. Industry watchers say OpenAI could be that customer, given its scale and need for dedicated compute.

If successful, the partnership would not only help OpenAI gain greater control over its AI infrastructure but also cement Broadcom’s position as a leading custom silicon provider in the generative AI era.

Xiaomi to Launch Self-Developed XringO1 Mobile Chip in Late May

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Xiaomi is set to unveil its latest in-house mobile chip, the XringO1, in late May, marking a renewed push into proprietary silicon development as competition heats up in China’s smartphone market. The announcement came from CEO Lei Jun on Weibo, though technical details remain limited.

Key Developments:

  • The XringO1 chip was reportedly built using ARM architecture and manufactured by TSMC using its advanced 3-nanometer (3nm) node — currently one of the most cutting-edge fabrication processes.

  • This move signifies Xiaomi’s return to high-end chip design, following earlier efforts like the Pengpai S1 in 2017, which was ultimately discontinued due to cost and complexity.

  • Xiaomi had since shifted focus to image sensors and power management ICs, but resumed processor development in 2021, according to sources familiar with the project.

Strategic Significance:

The launch positions Xiaomi to compete more directly with Apple and Huawei, both of which use custom-designed chips to drive hardware-software integration and performance optimization:

  • Apple has long utilized its own A-series and M-series chips, creating a tightly controlled ecosystem.

  • Huawei, despite U.S. sanctions, has pushed ahead with its Kirin chip series via SMIC.

Xiaomi’s goal is to use the XringO1 chip in its premium smartphones and tablets, potentially phasing in custom silicon to reduce dependency on foreign suppliers such as Qualcomm, which remains Xiaomi’s primary chip partner.

Market & Political Context:

  • The Xiaomi 15 Ultra, launched earlier this year, uses Qualcomm’s Snapdragon 8 Elite, but future models could see a transition to Xiaomi silicon.

  • While U.S. export restrictions now limit TSMC’s ability to produce AI chips for Chinese clients at advanced nodes, smartphone chips — such as XringO1 — are currently exempt from those restrictions.

Xiaomi ranks as the world’s third-largest smartphone manufacturer, and its expansion into EVs, home appliances, and AI devices makes chip autonomy increasingly strategic.

Neither Xiaomi nor Qualcomm responded to requests for comment at the time of reporting.