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Huawei outlines chip roadmap, challenges Nvidia with AI supernodes

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Huawei unveiled its long-term semiconductor strategy at the Huawei Connect conference in Shanghai, presenting detailed timelines for its Ascend AI chips, Kunpeng server processors, and next-generation computing systems. The move signals China’s determination to reduce reliance on foreign chipmakers like Nvidia while intensifying the U.S.-China tech rivalry.

Rotating chairman Eric Xu announced that Huawei will release new Ascend chips annually, doubling compute power with each iteration. The company launched its Ascend 910C earlier this year and plans to follow with the Ascend 950 in 2026, the 960 in 2027, and the 970 in 2028. Alongside, Huawei is preparing high-performance “supernodes” designed to interconnect thousands of chips at high speed. The Atlas 950 system, expected in late 2026, will link 8,192 Ascend chips, while the Atlas 960 in 2027 will support 15,488 chips—leaps over the existing Atlas 900.

Huawei also revealed it has developed proprietary high-bandwidth memory (HBM), a field dominated by South Korea’s SK Hynix and Samsung, strengthening its position in advanced computing. Updated versions of its Kunpeng server chip are scheduled for 2026 and 2028.

The timing of the announcement coincides with escalating tensions: Chinese regulators have accused Nvidia of antitrust violations and ordered local firms to halt purchases of its AI chips. Analysts say Huawei’s show of strength reflects growing confidence that U.S. export controls will not derail China’s domestic chipmaking progress.

Despite Huawei’s advances, engineers acknowledge Nvidia’s chips still outperform Chinese alternatives. However, Huawei is betting on leveraging China’s networking and power infrastructure advantages to offset manufacturing gaps and push large-scale systems forward.

Chinese semiconductor stocks rallied after reports of Beijing’s restrictions on Nvidia sales. The geopolitical backdrop looms large, with President Xi Jinping set to meet U.S. President Donald Trump amid renewed trade negotiations.

Samsung Electronics Faces 39% Drop in Q2 Profit Amid Weak AI Chip Sales

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Samsung Electronics is expected to report a 39% decline in its second-quarter operating profit, largely due to delays in supplying advanced memory chips to AI chip leader Nvidia, industry analysts said. The South Korean tech giant is forecast to announce an operating profit of 6.3 trillion won ($4.62 billion) for April to June, marking its lowest earnings in six quarters, according to LSEG SmartEStimate.

This downturn has raised concerns about Samsung’s ability to compete with rivals like SK Hynix and Micron in the rapidly growing market for high-bandwidth memory (HBM) chips used in artificial intelligence data centers. While its competitors have seen strong demand, Samsung’s growth has been limited by its heavy reliance on the China market, where U.S. export restrictions have curbed sales of advanced chips.

Analysts point out that Samsung’s latest HBM chips, specifically the HBM3E 12-high version, have not yet received Nvidia’s certification, slowing supply to the U.S. AI chip leader. Ryu Young-ho, senior analyst at NH Investment & Securities, noted that Samsung’s shipments to Nvidia are unlikely to be significant in 2025. Samsung has, however, started supplying the new chip to AMD since June.

Despite challenges in the chip segment, Samsung’s smartphone sales remain steady, supported by stockpiling ahead of potential U.S. tariffs on imported devices. Nonetheless, ongoing U.S. trade policies, including proposed tariffs on non-U.S.-made smartphones and possible restrictions on technology exports to Samsung’s Chinese plants, continue to create business uncertainty.

Samsung’s shares have underperformed this year compared to the KOSPI index, rising about 19% against the KOSPI’s 27.3% increase. As of Monday, Samsung shares dipped 1.9%, while the KOSPI rose 0.3%.

SK Hynix Reports Early Orders Ahead of Potential US Tariffs

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South Korean memory chipmaker SK Hynix announced on Thursday that some customers have accelerated their orders in anticipation of potential US tariffs on semiconductors. Speaking at the company’s annual shareholder meeting, Lee Sang-rak, Head of Global Sales and Marketing, attributed recent favorable market conditions to this “pull-in” effect and reduced customer inventory levels. However, he cautioned that it remains uncertain whether this trend will continue.

In January, SK Hynix projected a 10%-20% drop in DRAM and NAND flash memory shipments for Q1 2024. However, demand from the AI sector has contributed to price increases by competitors such as Micron, SanDisk, and China’s YMTC. Reports suggest that fears of impending US semiconductor tariffs, potentially reaching 25%, have led to increased inventory transfers to the US.

Despite concerns about AI hardware spending, SK Hynix remains optimistic about explosive growth in high bandwidth memory (HBM) chip demand, especially as a key supplier to Nvidia. CEO Kwak Noh-Jung confirmed that HBM sales for 2025 have already been fully booked, with negotiations for 2026 volume expected to conclude in the first half of this year.