Qualcomm announced a series of updates across its automotive, Internet of Things (IoT), and robotics businesses ahead of CES 2026. The chipmaker revealed several new processors designed for connected devices and intelligent machines, while also providing insights into the expanding reach of its automotive platforms. The centerpiece of these announcements was the introduction of the Dragonwing IQ10 series SoCs, created specifically for robotics applications with built-in support for AI workloads.
The Dragonwing IQ10 family is designed to support a wide variety of robots, ranging from industrial and service robots to autonomous systems that rely on on-device intelligence. Qualcomm emphasized that the new chipsets can handle demanding AI tasks while maintaining efficiency, making them suitable for real-time perception, decision-making, and control in robotics environments.
During a press briefing, Qualcomm said it will demonstrate several of these technologies at CES 2026, giving attendees a hands-on look at its latest innovations. Beyond robotics, the company highlighted progress in its IoT portfolio, noting that its processors are increasingly being used in smart infrastructure, industrial systems, and edge computing devices.
In the automotive segment, Qualcomm pointed to the growing adoption of its Snapdragon Digital Chassis platform, which it claims now powers over 400 million vehicles worldwide across different categories and price points. The platform is positioned as a core solution for connected vehicles, supporting digital cockpits, advanced driver assistance systems, connectivity, and cloud-based services.
The company also underlined the capabilities of its Ride Flex platform, describing it as the first solution to combine mixed-criticality ADAS workloads with in-vehicle infotainment on a single chip. On the high end, the Snapdragon Ride Elite SoC brings agentic AI features to premium automotive platforms, reinforcing Qualcomm’s focus on software-defined and AI-driven vehicles.
