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US May Target Samsung, Hynix, and TSMC Operations in China by Revoking Trade Authorizations

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The U.S. Department of Commerce is considering revoking authorizations granted in recent years to major chipmakers Samsung, SK Hynix, and TSMC that allow them to receive U.S. goods and technology at their manufacturing plants in China, sources familiar with the matter said. This potential move would complicate operations for these foreign semiconductor firms in China, where they produce chips used across many industries.

While the likelihood of the U.S. actually withdrawing these authorizations remains uncertain, officials view the tactic as a contingency if the current trade truce between the U.S. and China deteriorates. A White House official emphasized that the U.S. is “just laying the groundwork” and expressed confidence the trade agreement would continue, including the agreed supply of rare earth minerals from China. The official clarified that “there is currently no intention of deploying this tactic,” but it remains a tool in case bilateral relations worsen.

Following early reports, shares of U.S. semiconductor equipment suppliers that serve Chinese plants dropped: KLA Corp fell 2.4%, Lam Research declined 1.9%, and Applied Materials sank 2%. Conversely, shares of Micron Technology, a key competitor to Samsung and SK Hynix in memory chips, rose 1.5%.

TSMC declined to comment, while Samsung and SK Hynix did not respond to requests for comment. Lam Research, KLA, and Applied Materials also did not immediately respond.

Background: In October 2022, the U.S. imposed broad restrictions on chipmaking equipment exports to China but provided foreign firms like Samsung and SK Hynix with letters authorizing shipments. In 2023 and 2024, these companies received “Validated End User” (VEU) status, which allows them to obtain U.S.-controlled products more quickly and reliably without needing multiple export licenses. However, VEU status comes with conditions such as equipment prohibitions and reporting requirements.

A Commerce Department spokesperson said chipmakers would still be able to operate in China if the authorizations are revoked. The enforcement mechanisms would align with licensing rules for other semiconductor firms exporting to China, ensuring the U.S. applies an equal and reciprocal approach.

Industry insiders warn that stricter U.S. controls could unintentionally benefit Chinese domestic competitors by making it harder for foreign companies to receive equipment, calling such a move “a gift” to China’s semiconductor industry.

AMD Unveils AI Server and Chips as OpenAI Joins Development Effort

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AMD CEO Lisa Su introduced a major new line of AI hardware on Thursday, unveiling both the MI350 and MI400 series of AI chips and announcing plans to release the company’s first AI server, called “Helios,” in 2026. The launch signals AMD’s most direct challenge yet to Nvidia’s dominance in the AI server and chip market.

The announcement was made at AMD’s “Advancing AI” developer conference in San Jose, California. The Helios servers will house 72 MI400 chips, designed to compete directly with Nvidia’s current NVL72 servers powered by its Blackwell processors. In a notable difference from Nvidia’s closed ecosystem, Su emphasized that many aspects of AMD’s server and networking standards would be openly available to the broader industry, including rivals like Intel.

“The future of AI is not going to be built by any one company or in a closed ecosystem. It’s going to be shaped by open collaboration across the industry,” Su stated.

Su was joined on stage by OpenAI CEO Sam Altman, who confirmed that OpenAI is already working with AMD on its MI450 chips to help optimize them for AI workloads. Altman remarked on OpenAI’s rapid infrastructure growth, calling the pace “crazy” and noting continued expansion with AMD’s hardware.

Executives from Meta Platforms, Elon Musk’s xAI, and Oracle also appeared during the event to showcase how their companies are adopting AMD’s processors. Additionally, Crusoe, a cloud provider specializing in AI, disclosed plans to purchase $400 million worth of AMD’s new chips.

Despite the announcement, AMD shares slipped 2.2%, with analysts suggesting the company still faces significant headwinds in dislodging Nvidia’s dominant market position. Summit Insights analyst Kinngai Chan noted that the newly announced products are unlikely to shift the competitive balance immediately.

AMD has aggressively expanded its AI capabilities over the past year, completing its acquisition of server manufacturer ZT Systems in March and making 25 strategic investments in AI-related startups. The company recently hired engineers from Untether AI and Lamini, further strengthening its chip design and software development teams.

However, AMD’s ROCm software stack continues to lag behind Nvidia’s highly entrenched CUDA platform, which many in the industry see as a major factor behind Nvidia’s dominance.

Nevertheless, AMD remains optimistic about its growth prospects, even as U.S. export controls tighten on AI chip sales to China. When reporting earnings in May, Su reiterated expectations for strong double-digit growth in AI chip sales despite these headwinds.

Besi Raises Long-Term Financial Targets on Growing AI Chip Demand

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BE Semiconductor Industries (Besi) has raised its long-term revenue and operating margin targets ahead of its investor day, citing strong demand from AI chipmakers adopting its advanced hybrid bonding technology. The Dutch company specializes in the world’s most precise hybrid bonding tools, a key technology for stacking multiple chips directly on top of each other to boost performance.

At the event, Besi’s Senior Vice President Technology Chris Scanlan highlighted that major AI chip designers Nvidia and Broadcom are looking to utilize Taiwan Semiconductor Manufacturing Co’s (TSMC) hybrid bonding process, which could increase demand for Besi’s equipment. Additionally, Intel and AMD are expanding their use of hybrid bonding technology.

Besi now projects long-term revenues between €1.5 billion and €1.9 billion ($1.73 billion to $2.19 billion), up from a previous forecast of €1 billion, and expects operating margins of 40% to 55%, an increase from 35% to 50%. Shares rose 8.4% during the trading day, outperforming the Netherlands’ AEX index.

As traditional performance gains from shrinking chip features approach physical limits, the industry is shifting towards advanced packaging methods like hybrid bonding to create faster, more powerful chips. Limits on reticule exposure in ASML’s lithography machines have also pushed chipmakers to combine multiple chips by stitching or stacking. For example, TSMC recently demonstrated a large package containing over 16 chips stitched together.

While Besi and its investors are optimistic about the company’s position as a key supplier to cutting-edge chipmakers, some analysts expressed caution. Degroof Petercam noted that Besi’s raised targets come despite the company not yet reaching its earlier goals. So far this year, Besi shares have declined by 3.2%.