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New York approves key power line for Micron’s $100 billion semiconductor megafab

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New York State has approved a critical underground power transmission line to connect an existing substation in Clay with Micron Technology’s planned $100 billion semiconductor megafab in Onondaga County, Governor Kathy Hochul announced on Thursday.

The two-mile, 345-kilovolt line will deliver electricity to the chipmaker’s future facility — the largest private investment in New York’s history — and marks another major step toward the project’s construction phase.

“This project is set to transform Central New York — and we’re moving quickly ahead with all due speed and deliberation,” Hochul said.

The megafab, part of a 2022 agreement between Micron and New York State, is expected to create more than 50,000 jobs over the next two decades, including 9,000 direct Micron positions. Once fully operational, the site aims to produce 25% of all U.S.-made semiconductors by 2030, helping to strengthen domestic chip supply chains.

The state’s Public Service Commission also approved the environmental and construction plans for the project’s first phase, which includes the eastern expansion of the Clay substation and new equipment installation to link it to Micron’s future campus.

The move underscores New York’s broader effort to position itself as a national hub for semiconductor manufacturing, competing with other chipmaking centers in Arizona, Texas, and Ohio.

TSMC to Phase Out 6-Inch Wafer Production Over Two Years

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Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Tuesday that it will gradually phase out its 6-inch wafer manufacturing business over the next two years, while continuing to consolidate 8-inch wafer production to improve operational efficiency.

STRATEGIC MOVE

  • The decision was made after a thorough evaluation of market conditions and aligns with TSMC’s long-term business strategy.

  • The company emphasized that the transition will be managed closely with customers to ensure their needs are met.

  • TSMC stated that this move will not impact previously announced financial targets.

MANUFACTURING CAPACITY

  • TSMC currently operates one 6-inch wafer fab and four 8-inch wafer fabs in Taiwan for mature-node chip production.

  • Advanced-node chip manufacturing, used by clients like Apple and Nvidia, is conducted in 12-inch fabs.

  • In July, TSMC forecasted annual revenue growth of approximately 30% in U.S. dollar terms.

RATIONALE
The phase-out reflects market trends and efficiency goals, allowing TSMC to focus resources on more in-demand wafer sizes and advanced technologies.

Texas Instruments to Invest $60 Billion in U.S. Chip Manufacturing Amid Political Pressure

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Texas Instruments (TI) announced plans on Wednesday to invest over $60 billion to expand its semiconductor manufacturing facilities in the United States. This move comes amid ongoing pressure from the Trump administration to reshore the country’s semiconductor supply chain.

The Biden administration finalized a $1.61 billion subsidy for TI in December to support the construction of three new facilities, part of the broader $52.7 billion CHIPS and Science Act. TI’s investment plan includes building or expanding seven chip-making plants across Texas and Utah, with two new sites planned in Sherman, Texas. The company said this investment would create 60,000 jobs, calling it the largest foundational semiconductor manufacturing investment in U.S. history.

TI expects to spend up to $40 billion on its Sherman operations and approximately $21 billion on facilities in Utah and other parts of Texas. While no exact timeline was provided, TI confirmed its long-term capital expenditure plans remain unchanged.

Unlike AI-focused chipmakers Nvidia and AMD, TI specializes in analog chips used in everyday electronics such as smartphones, cars, and medical devices. This gives TI a broad client base, including Apple, SpaceX, and Ford.

The $60 billion investment follows similar announcements from other semiconductor companies. For example, Micron recently revealed it would increase its U.S. investment by $30 billion, bringing its total planned spending to $200 billion.

Some analysts interpret these spending announcements as efforts to gain favor with former President Donald Trump, who has threatened to block the CHIPS Act funding and impose tariffs on semiconductor imports.

U.S. Commerce Secretary Howard Lutnick praised the investment, stating it would support “foundational semiconductors that go into the electronics people use every day” and sustain U.S. chip manufacturing for decades.

TI’s announcement also includes previously allocated funds for facilities already under construction or scaling up production.