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US Targets Chinese Companies Over AI Chips and Military Concerns

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The Biden administration has blacklisted more than two dozen Chinese entities, including Zhipu AI, a prominent developer of large language models, and Sophgo, a company implicated in using Taiwan Semiconductor Manufacturing Company (TSMC) chips for Huawei’s AI processors. This move is part of the U.S.’s ongoing efforts to curb China’s access to advanced technology, particularly in the fields of artificial intelligence (AI) and military applications.

The U.S. Commerce Department added 25 Chinese companies, along with two Singapore-based companies, to its Entity List, effectively restricting their access to U.S. goods and technology without special licenses, which are typically denied. Zhipu AI, backed by major investors like Alibaba and Tencent, was blacklisted for its involvement in advancing China’s military AI capabilities. Sophgo, which supplied a chip found in Huawei’s Ascend 910B AI system, also came under scrutiny for its role in supporting Huawei’s AI ambitions, a company already restricted since 2019.

In response, Zhipu AI denied the allegations, claiming the decision lacked factual basis and wouldn’t significantly impact its operations. Similarly, Sophgo, an affiliate of Bitmain, a leading bitcoin mining equipment supplier, also rejected claims of any direct ties with Huawei.

The U.S. also implemented stricter rules for the export of semiconductors, specifically those used in AI applications, particularly targeting advanced chips at or below 14 or 16 nanometer nodes. The new regulations aim to prevent these chips from being used in military technologies or high-tech surveillance systems, further tightening restrictions on Chinese companies like Changxin Memory Technologies, a major DRAM producer.

The expanded controls also hold chipmakers accountable for ensuring that their products do not end up in the hands of restricted entities, including companies potentially linked to Huawei’s operations.

These moves are part of broader efforts by the U.S. to limit China’s access to critical technology, especially in areas like AI and advanced military systems, and to curtail the risk of sensitive technologies being diverted to entities like Huawei.

 

TSMC Reports Record Quarterly Profit, Expects Strong Growth in Early 2025

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Taiwan Semiconductor Manufacturing Co (TSMC) has posted a record-breaking quarterly profit, reporting a 57% increase in net income to T$374.68 billion ($11.4 billion) for the quarter ending Dec. 31. This surge in profit aligns with the company’s bullish outlook for the future, as revenue jumped by 39% compared to the same period last year. TSMC has forecasted continued strong performance, with a revenue growth estimate of about 37% for the first quarter of 2025, projecting earnings between $25-25.8 billion. For the full year, TSMC expects revenue growth to be between 20% and 30%, driven largely by the demand for chips used in artificial intelligence (AI) processing.

While TSMC’s business is thriving, it faces challenges stemming from U.S. government restrictions on AI chip exports to China. The Biden administration recently announced further curbs on these exports, which could affect demand from clients. However, TSMC’s CEO, C.C. Wei, expressed confidence that the company could manage these restrictions, stating that they are currently applying for special permits for affected clients and anticipating approval. He also emphasized the company’s strong communication with both the current and incoming U.S. administrations.

TSMC’s growth is also supported by its ambitious expansion plans, including new fabs in the United States, Japan, Germany, and Taiwan. For 2025, TSMC has set its capital spending target between $38 billion and $42 billion, marking a potential 41% increase. The AI-driven boom has significantly boosted TSMC’s stock price, which surged 81% in 2024, outperforming the broader market’s 28.5% growth.

 

Nvidia Shifts Focus to New Advanced Packaging Technology

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Nvidia’s CEO Jensen Huang confirmed that while the company’s demand for advanced packaging from TSMC remains robust, the specific type of technology required is evolving. At an event in Taichung, Taiwan, Huang explained that Nvidia is transitioning its focus from CoWoS-S to CoWoS-L for its upcoming Blackwell AI chips. This shift, however, does not signal a reduction in capacity, but rather an increase in the use of CoWoS-L, a newer, more advanced version of TSMC’s chip packaging technology.

Nvidia had previously relied heavily on CoWoS-S for its AI chips, including the Hopper platform. As the company moves into Blackwell, which was unveiled in March 2024, it plans to transition existing CoWoS-S capacity to CoWoS-L. This change will impact TSMC’s supply chain but is seen as a step forward in Nvidia’s push to meet the growing demand for its AI chips.

Huang also noted that while packaging capacity for these advanced chips had previously been a bottleneck, it had expanded significantly in recent years, with available capacity now approximately four times greater than it was two years ago. Despite the increased demand, Nvidia has not been cutting orders but is instead increasing its reliance on CoWoS-L, which is expected to better meet the needs of Blackwell’s design.

The move to CoWoS-L technology and changes in Nvidia’s order patterns have sparked speculation about the potential impact on TSMC’s revenue, particularly with analysts like Ming-Chi Kuo noting the shift in Nvidia’s focus. Huang declined to comment on recent U.S. export restrictions that limit AI chip sales to countries outside a select group of U.S. allies, but the company’s strategies continue to evolve in response to market demands and geopolitical factors.