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Super Micro Shares Plunge on Chip Smuggling Charges

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Super Micro shares dropped sharply after U.S. prosecutors charged three people linked to the company, including its co-founder, over an alleged scheme to smuggle AI technology to China.

Although the company itself was not named as a defendant, the case has raised serious concerns among investors about legal, reputational and commercial risks. Super Micro said it cooperated with investigators, placed the employees involved on leave and ended ties with a contractor connected to the matter.

According to U.S. authorities, the accused helped move billions of dollars worth of American AI server technology through third countries before the products were allegedly redirected into China. The case comes amid strict U.S. export controls designed to limit China’s access to advanced semiconductor and AI infrastructure.

The market reaction reflects broader fears that customers may reconsider supplier relationships and that the company could face increased scrutiny. Analysts also noted that rival server makers could benefit if buyers seek alternatives.

The development adds fresh pressure on Super Micro, which had already faced volatility tied to margin concerns and previous market criticism despite strong demand linked to the AI boom.

Broadcom Targets 3D Chip Sales

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Broadcom expects to sell at least one million advanced stacked chips by 2027, signaling a major step forward in its AI hardware strategy.

The company’s technology combines multiple silicon layers into a single integrated unit, improving performance and energy efficiency for high-demand computing tasks.

Early engineering samples are already being tested by partners, with broader production planned in the coming years. The design enables greater data flow between components, supporting increasingly complex AI workloads.

Broadcom’s approach also allows flexibility in manufacturing processes, helping customers tailor chip performance to specific needs.

The initiative is expected to open a substantial new revenue stream while strengthening the company’s position in the competitive AI semiconductor landscape.

Samsung Begins Shipping HBM4 Chips to Boost AI Position

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Samsung Electronics said it has started shipping its most advanced high-bandwidth memory chips, HBM4, as it seeks to close the gap with rivals in supplying critical components for artificial intelligence accelerators.

Demand for high-performance memory has surged amid the global buildout of AI data centers. HBM chips are essential for feeding large volumes of data into AI accelerators, including those developed by Nvidia. Samsung has previously trailed competitors such as SK Hynix in delivering earlier-generation HBM products.

Samsung said its HBM4 chips deliver a consistent processing speed of 11.7 gigabits per second, a 22% improvement over its HBM3E predecessor, with peak speeds reaching 13 Gbps to address growing data bottlenecks. The company added that it plans to provide samples of next-generation HBM4E chips in the second half of the year.

Shares of Samsung rose following the announcement, reflecting investor optimism about its efforts to regain momentum in the competitive AI memory market. SK Hynix, which has maintained a leading position in HBM production, has said it aims to preserve its strong market share as competition intensifies. Meanwhile, U.S.-based Micron Technology has also begun high-volume production and customer shipments of HBM4.

The rollout underscores intensifying competition among memory manufacturers as AI infrastructure expansion continues to drive demand for faster, more efficient chip technologies.