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SK Hynix Places $8B Order for ASML Chip Tools

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SK Hynix has announced a major purchase of chipmaking equipment from ASML, committing nearly $8 billion in what is the largest publicly disclosed order for the Dutch supplier’s lithography systems.

The deal covers extreme ultraviolet (EUV) machines, which are critical for producing advanced semiconductors used in artificial intelligence and high-performance computing. The equipment will be delivered by the end of 2027 and is expected to support the company’s next-generation production capacity.

Analysts say the tools will be deployed across SK Hynix’s upcoming Yongin facility as well as its M15X plant in Cheongju, both of which are key to scaling production of high-bandwidth memory and advanced DRAM chips.

The investment reflects strong demand for AI-related semiconductors, where memory chips play a central role. It also signals SK Hynix’s effort to secure manufacturing capacity ahead of competitors in a tightening supply environment.

The order highlights the growing importance of EUV technology in enabling smaller, faster and more efficient chips, as the semiconductor industry continues to evolve around AI-driven workloads.

Super Micro Shares Plunge on Chip Smuggling Charges

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Super Micro shares dropped sharply after U.S. prosecutors charged three people linked to the company, including its co-founder, over an alleged scheme to smuggle AI technology to China.

Although the company itself was not named as a defendant, the case has raised serious concerns among investors about legal, reputational and commercial risks. Super Micro said it cooperated with investigators, placed the employees involved on leave and ended ties with a contractor connected to the matter.

According to U.S. authorities, the accused helped move billions of dollars worth of American AI server technology through third countries before the products were allegedly redirected into China. The case comes amid strict U.S. export controls designed to limit China’s access to advanced semiconductor and AI infrastructure.

The market reaction reflects broader fears that customers may reconsider supplier relationships and that the company could face increased scrutiny. Analysts also noted that rival server makers could benefit if buyers seek alternatives.

The development adds fresh pressure on Super Micro, which had already faced volatility tied to margin concerns and previous market criticism despite strong demand linked to the AI boom.

Broadcom Targets 3D Chip Sales

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Broadcom expects to sell at least one million advanced stacked chips by 2027, signaling a major step forward in its AI hardware strategy.

The company’s technology combines multiple silicon layers into a single integrated unit, improving performance and energy efficiency for high-demand computing tasks.

Early engineering samples are already being tested by partners, with broader production planned in the coming years. The design enables greater data flow between components, supporting increasingly complex AI workloads.

Broadcom’s approach also allows flexibility in manufacturing processes, helping customers tailor chip performance to specific needs.

The initiative is expected to open a substantial new revenue stream while strengthening the company’s position in the competitive AI semiconductor landscape.