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Exclusive: Crusoe’s ‘Neocloud’ to Buy $400 Million in AMD AI Chips for Data Centers

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Crusoe, an artificial intelligence-focused cloud computing startup, revealed plans to purchase approximately $400 million worth of AI chips from Advanced Micro Devices (AMD) to power its AI data centers. CEO Chase Lochmiller told Reuters that Crusoe intends to acquire around 13,000 AMD MI355X chips for a new data center cluster in the U.S., which is expected to become operational this fall.

The data center will employ liquid cooling technology and be designed specifically to house AI chips, offering higher performance compared to older infrastructure. Crusoe will rent access to this facility, which can be partitioned among multiple clients or used entirely by a single customer.

Lochmiller emphasized Crusoe’s agility as a smaller startup, competing with larger hyperscalers by leveraging speed, nimbleness, and concentrated engineering talent.

AMD’s MI355X chips, featuring high-bandwidth memory, are optimized for AI inference tasks, providing an alternative to Nvidia’s dominant hardware in the AI chip market. While many AI cloud services rely on Nvidia chips, AMD is positioning itself to capture a share by partnering with companies like Crusoe.

Lochmiller described this approach as a validation of the “neocloud” strategy — specialized cloud infrastructure platforms tailored for AI workloads that add significant value to the AI ecosystem by supporting large-scale users.

Besi Raises Long-Term Financial Targets on Growing AI Chip Demand

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BE Semiconductor Industries (Besi) has raised its long-term revenue and operating margin targets ahead of its investor day, citing strong demand from AI chipmakers adopting its advanced hybrid bonding technology. The Dutch company specializes in the world’s most precise hybrid bonding tools, a key technology for stacking multiple chips directly on top of each other to boost performance.

At the event, Besi’s Senior Vice President Technology Chris Scanlan highlighted that major AI chip designers Nvidia and Broadcom are looking to utilize Taiwan Semiconductor Manufacturing Co’s (TSMC) hybrid bonding process, which could increase demand for Besi’s equipment. Additionally, Intel and AMD are expanding their use of hybrid bonding technology.

Besi now projects long-term revenues between €1.5 billion and €1.9 billion ($1.73 billion to $2.19 billion), up from a previous forecast of €1 billion, and expects operating margins of 40% to 55%, an increase from 35% to 50%. Shares rose 8.4% during the trading day, outperforming the Netherlands’ AEX index.

As traditional performance gains from shrinking chip features approach physical limits, the industry is shifting towards advanced packaging methods like hybrid bonding to create faster, more powerful chips. Limits on reticule exposure in ASML’s lithography machines have also pushed chipmakers to combine multiple chips by stitching or stacking. For example, TSMC recently demonstrated a large package containing over 16 chips stitched together.

While Besi and its investors are optimistic about the company’s position as a key supplier to cutting-edge chipmakers, some analysts expressed caution. Degroof Petercam noted that Besi’s raised targets come despite the company not yet reaching its earlier goals. So far this year, Besi shares have declined by 3.2%.

Trump AI Czar Downplays Risk of AI Chip Smuggling, Warns Against Overregulation

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David Sacks, the White House AI czar under former President Donald Trump, on Tuesday minimized concerns about American AI chips being smuggled to adversaries, emphasizing the physical size and security of such equipment. Speaking at the AWS summit in Washington, Sacks explained that AI chips are housed in massive server racks weighing two tons, making clandestine smuggling highly unlikely.

Sacks expressed worries that stringent U.S. AI regulations could hinder innovation and growth, potentially ceding the global AI market to China. “We talk about these chips like they could be smuggled in the back of a briefcase. That’s not what they look like,” he said. He criticized efforts by state legislatures to regulate AI and permitting obstacles for data center construction.

Contrasting with President Joe Biden’s policies, which focused on curbing chip exports to China and addressing risks of AI misuse, the Trump administration revoked several Biden-era executive orders aimed at controlling AI diffusion and competition. Sacks argued that the Biden restrictions risk pushing countries like the United Arab Emirates closer to China, citing a recent U.S.-UAE plan to build a major AI campus abroad.

“We rescinded that Biden diffusion rule, which…made diffusion a bad word. Diffusion of our technology should be a good word,” Sacks said.

He warned that if AI chips made by Chinese giant Huawei become widespread globally within five years, it would signify a strategic loss for the U.S. Highlighting the rapid pace of Chinese AI development, Sacks stated, “China is not years and years behind us in AI. Maybe they’re three to six months.” The White House later clarified that Chinese AI chips lag one to two years behind U.S. technology, while their AI models are closer in capability.