TSMC to Phase Out 6-Inch Wafer Production Over Two Years
Taiwan Semiconductor Manufacturing Co. (TSMC) announced on Tuesday that it will gradually phase out its 6-inch wafer manufacturing business over the next two years, while continuing to consolidate 8-inch wafer production to improve operational efficiency.
STRATEGIC MOVE
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The decision was made after a thorough evaluation of market conditions and aligns with TSMC’s long-term business strategy.
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The company emphasized that the transition will be managed closely with customers to ensure their needs are met.
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TSMC stated that this move will not impact previously announced financial targets.
MANUFACTURING CAPACITY
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TSMC currently operates one 6-inch wafer fab and four 8-inch wafer fabs in Taiwan for mature-node chip production.
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Advanced-node chip manufacturing, used by clients like Apple and Nvidia, is conducted in 12-inch fabs.
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In July, TSMC forecasted annual revenue growth of approximately 30% in U.S. dollar terms.
RATIONALE
The phase-out reflects market trends and efficiency goals, allowing TSMC to focus resources on more in-demand wafer sizes and advanced technologies.



