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Intel Debuts Arc Pro B-Series GPUs With Built-In XMX AI Cores and Enhanced Ray Tracing Capabilities

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Intel has officially launched its Arc Pro B-series graphics processing units (GPUs) at Computex 2025, targeting the growing demand for high-performance GPUs in professional workstations and AI inference tasks. Designed with larger memory capacities and expanded software compatibility, these GPUs aim to serve developers, creators, and engineers who require robust computational and graphical power. The lineup includes two models: the Intel Arc Pro B50 and Arc Pro B60. Both GPUs are built on Intel’s latest Xe2 architecture and come equipped with advanced ray tracing units and Intel’s Xe Matrix Extensions (XMX) AI cores.

The Arc Pro B60 GPU will hit the market first, with availability beginning in June 2025 through Intel’s add-in board partners such as ASRock, Gunnir, Maxsun, and Sparkle. Intel has yet to announce the pricing for this model. The Arc Pro B50, on the other hand, will be available starting July via Intel-authorized resellers at a price of $299 (roughly Rs. 25,500). These GPUs come in a variety of partner board form factors, allowing flexibility in deployment across different workstation builds.

Specifically tailored for professional-grade applications, the Arc Pro B-series GPUs are built to handle demanding workloads such as 3D rendering, real-time ray tracing, and AI model inference. Intel claims that these GPUs offer up to 3.4 times better graphical fidelity and up to 3.5 times higher inference performance in AI models like Stable Diffusion when compared to Nvidia’s RTX A1000 8GB. These performance gains highlight Intel’s ambition to compete in the enterprise GPU market, particularly for creators and AI developers.

In addition to the hardware upgrades, Intel has also emphasized its commitment to improving the software stack that supports the Arc Pro B-series. With optimized drivers and expanded compatibility for professional applications, users can expect smoother performance across workflows in CAD, media production, and AI training. The launch of the Arc Pro B-series marks a strategic move by Intel to not only bolster its presence in the GPU space but also cater directly to industries increasingly reliant on AI-driven computation and high-end graphics.

Intel Weighs Sale of Networking and Edge Unit in Strategic Refocus Under New CEO

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Intel is considering divesting its networking and edge computing division — previously known as NEX — as part of a broader strategy to streamline operations and refocus on its core strengths in PC and data center chips, according to sources familiar with internal discussions.

Under new CEO Lip-Bu Tan, the tech giant is evaluating the relevance of its diverse business units to prioritize areas where it maintains market leadership. Tan emphasized at an event in Taipei that Intel commands 68% of the PC chip market and 55% of the data center chip market, and plans to “expand and build on” those domains.

Although no formal sale process has been launched yet, Intel has initiated early-stage discussions, spoken with third parties potentially interested in the NEX business, and interviewed investment banks to possibly advise on the transaction. However, no advisor has been officially retained, and options remain open.

Sources indicate that the networking and edge unit — which generated $5.8 billion in revenue in 2024 — is no longer seen as essential to Intel’s growth plans. The company now folds NEX’s financials into its broader PC and data center segments, eliminating separate reporting.

The telecom-focused segment within NEX is especially seen as misaligned with Intel’s new direction, and competitors like Broadcom dominate significant parts of the networking market, further reducing Intel’s strategic incentive to compete there.

While Intel has not committed to a full divestiture, it may explore partnerships, stake sales, or restructuring alternatives. The potential NEX sale follows other recent portfolio adjustments — notably, the $4.46 billion sale of a majority stake in its Altera unit to SilverLake in April. That move came after previously planned IPO ambitions for Altera under former CEO Pat Gelsinger.

Despite this refocusing, Intel continues to face pressure as it loses ground in the PC and data center markets, making Tan’s efforts a critical pivot point for the company’s future trajectory.

ASM to Pass Tariff Costs to Customers, Maintains Competitive Edge

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ASM International, Europe’s second-largest semiconductor equipment supplier, announced it will pass on any tariff-related cost increases to customers and the broader value chain. In a meeting with Bank of America analysts, ASM’s CEO and CFO emphasized that the company’s manufacturing flexibility ensures it won’t be at a disadvantage compared to global peers.

Key Points:

  • ASM said it would adjust pricing to offset potential cost pressures from U.S. trade tariffs, a strategy aligned with competitors like ASML, which previously stated that U.S. chipmakers would bear the bulk of such costs.

  • The Dutch company manufactures wafer fab processing equipment, vital for chipmakers like Intel and TSMC as they adopt next-gen Gate-All-Around transistor designs.

  • In other areas, ASM competes with major U.S. firms like Applied Materials and LAM Research, and is noted to be more exposed to the U.S. market than other European peers such as ASML and BE Semiconductor.

Market Outlook:

ASM also provided a bullish forecast for China, saying Chinese sales could hit the high end—or exceed—their 2025 guidance. The company previously estimated that China would represent between 20–29% of its total sales in 2025.

This positive outlook aligns with ASML’s recent commentary, which noted stronger-than-expected Chinese demand in its own Q1 report.

Despite rising geopolitical tensions and trade restrictions, ASM appears confident in navigating the shifting global semiconductor landscape, leveraging pricing power, regional flexibility, and strong demand from Asia.