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ASM to Pass Tariff Costs to Customers, Maintains Competitive Edge

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ASM International, Europe’s second-largest semiconductor equipment supplier, announced it will pass on any tariff-related cost increases to customers and the broader value chain. In a meeting with Bank of America analysts, ASM’s CEO and CFO emphasized that the company’s manufacturing flexibility ensures it won’t be at a disadvantage compared to global peers.

Key Points:

  • ASM said it would adjust pricing to offset potential cost pressures from U.S. trade tariffs, a strategy aligned with competitors like ASML, which previously stated that U.S. chipmakers would bear the bulk of such costs.

  • The Dutch company manufactures wafer fab processing equipment, vital for chipmakers like Intel and TSMC as they adopt next-gen Gate-All-Around transistor designs.

  • In other areas, ASM competes with major U.S. firms like Applied Materials and LAM Research, and is noted to be more exposed to the U.S. market than other European peers such as ASML and BE Semiconductor.

Market Outlook:

ASM also provided a bullish forecast for China, saying Chinese sales could hit the high end—or exceed—their 2025 guidance. The company previously estimated that China would represent between 20–29% of its total sales in 2025.

This positive outlook aligns with ASML’s recent commentary, which noted stronger-than-expected Chinese demand in its own Q1 report.

Despite rising geopolitical tensions and trade restrictions, ASM appears confident in navigating the shifting global semiconductor landscape, leveraging pricing power, regional flexibility, and strong demand from Asia.

Intel Shareholders Approve CEO Compensation and Equity Incentive Plan Amid Leadership Shift

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Intel shareholders on Tuesday approved a new equity incentive plan designed to bolster stock reserves for attracting and retaining talent, as well as a $42 million stock-based compensation package for newly appointed CEO Lip-Bu Tan. The vote took place during the company’s first shareholder meeting under Tan’s leadership.

Intel shares fell 1.6% in early trading, extending a 36% decline over the past year, as investors digest the company’s ongoing leadership and strategic shifts.

Tan, who succeeded Pat Gelsinger in March after the board lost confidence in his high-cost turnaround efforts, will have his compensation tied to Intel’s future stock performance. Tan has already initiated a restructuring plan, which includes flattening the corporate hierarchy, cutting excess middle management, and recalibrating Intel’s artificial intelligence roadmap.

Shareholders also approved the current board of directors, although three members did not seek re-election. Meanwhile, three shareholder proposals were rejected, including:

  • A call to reassess Intel’s operations in Israel,

  • A demand for new charitable giving transparency, and

  • A proposal to allow shareholders to act by written consent.

Tan said he plans to capitalize on Intel’s established positions in the PC and data center markets to deliver more competitive AI products, signaling a strategic refocus in an increasingly crowded chip landscape.

Intel CEO Lip-Bu Tan Restructures Leadership, Appoints New Head of AI, Internal Memo Reveals

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Intel’s newly appointed CEO, Lip-Bu Tan, is initiating a significant leadership shakeup aimed at streamlining operations and strengthening the company’s engineering focus. In a recent internal memo obtained by Reuters, Tan revealed that several of Intel’s core chip divisions will now report directly to him, flattening the organizational structure in a move designed to bring greater agility and responsiveness to the semiconductor giant.

Among the key changes, Sachin Katti—formerly head of Intel’s networking chip division—has been promoted to serve as both Chief Technology Officer and head of Artificial Intelligence. This dual role signals the growing importance of AI in Intel’s strategic roadmap, as the company seeks to reassert its position in a highly competitive global market. The data center and AI chip group, along with the personal computing chip group, are now under Tan’s direct supervision, bypassing previous layers of management.

These leadership adjustments mark the first major strategic shift since Tan took the helm last month. They reflect a hands-on approach to reforming Intel after years of stagnation and missed opportunities in advanced chip manufacturing. Michelle Johnston Holthaus, who previously oversaw the groups now reporting to Tan, remains a key figure as CEO of Intel Products. Her responsibilities will be expanded into new areas as part of a broader reorganization still in development.

“I want to roll up my sleeves with the engineering and product teams so I can learn what’s needed to strengthen our solutions,” Tan wrote in the memo. His remarks underline a more engaged leadership style, with a clear emphasis on execution and product innovation. The restructuring also comes as Intel continues to face challenges from competitors and grapples with maintaining its technological edge. Tan’s early moves suggest a decisive effort to simplify operations and refocus the company on its engineering roots.