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Samsung to Start HBM4 Production for Nvidia Supply

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Samsung Electronics plans to begin production of its next-generation high-bandwidth memory chips, known as HBM4, next month and supply them to Nvidia, a person familiar with the matter told Reuters.

The move marks a key step in Samsung’s efforts to close the gap with local rival SK Hynix, which has emerged as the primary supplier of advanced memory used in Nvidia’s AI accelerators. Earlier supply delays had weighed on Samsung’s earnings and share price last year.

Samsung shares rose 2.2% in morning trade, while SK Hynix shares fell 2.9%. The source declined to disclose shipment volumes. Samsung declined to comment, and Nvidia was not immediately available for comment.

South Korean newspaper Korea Economic Daily reported that Samsung recently passed HBM4 qualification tests for Nvidia and AMD, and is set to begin shipments to Nvidia next month, citing industry sources.

SK Hynix said in October it had completed supply talks with major customers for next year and plans to deploy silicon wafers at its new M15X fab in Cheongju starting next month. It has not confirmed whether HBM4 will be part of the initial output.

Both Samsung and SK Hynix are due to report fourth-quarter earnings later this week, when further details on HBM4 orders are expected. Nvidia CEO Jensen Huang has said the company’s next-generation Vera Rubin AI platform is already in full production and will be paired with HBM4 chips later this year.

Taiwan Eyes More Chip Investment in Arizona to Deepen US Ties

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Taiwan is looking forward to further semiconductor investment in Arizona to strengthen economic and strategic ties with the United States, President Lai Ching-te said during a meeting with U.S. Senator Ruben Gallego. Lai highlighted the growing role of Taiwanese firms, led by TSMC, in boosting U.S. chip manufacturing capacity.

TSMC is investing $165 billion in the Phoenix area to build advanced fabrication plants producing chips used in artificial intelligence, marking one of the largest foreign investments in U.S. manufacturing. Lai said Taiwan hopes to see additional manufacturing, research and development facilities established in Arizona, further reinforcing bilateral cooperation.

The comments come shortly after Taiwan and the United States agreed to cut U.S. tariffs on Taiwanese exports to 15% from 20%. Under the deal, Taiwanese companies will invest $250 billion in U.S. semiconductors, energy and AI, alongside $250 billion in credit guarantees to support future projects.

Senator Gallego said Arizona had become a hub for Taiwanese investment and expressed optimism that the partnership would continue to expand.

Taiwan’s GlobalWafers Prepares Phase Two Expansion at Texas Plant

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Taiwanese silicon wafer maker GlobalWafers is preparing for a second-phase expansion of its Texas manufacturing plant, pending customer commitments, chairperson Doris Hsu said on Wednesday.

The company opened a $3.5 billion facility in Texas last year and later announced plans to invest an additional $4 billion in the United States to meet rising demand. The site is GlobalWafers’ most advanced fully integrated 300mm silicon wafer plant and is currently the only advanced wafer manufacturing facility of its kind in the U.S.

Hsu said customers have begun asking about further capacity increases, noting that the first phase serves multiple clients and may not be sufficient. GlobalWafers is moving ahead with factory design work to shorten timelines once commitments are finalized.

GlobalWafers supplies TSMC, which is investing heavily in U.S. chip production. The expansion aligns with a recent U.S.-Taiwan trade deal aimed at strengthening local semiconductor supply chains.