Report: Google’s Tensor G4 SoC Embraces FOWLP Tech for Enhanced Heat Management and Power Efficiency
Pixel 9 Series Set to Feature Google’s Tensor G4 Chip: Anticipated Launch Later in the Year
In October of the previous year, Google unveiled the Pixel 8 and Pixel 8 Pro, equipped with the Tensor G3 chipset, boasting several AI-driven features. Merely a few months post-release, leaks about the forthcoming generation of Pixel devices have begun surfacing across various online platforms. It’s rumored that Google’s upcoming system-on-chip (SoC) iteration — the Tensor G4 — will be the powerhouse behind the Pixel 9 and Pixel 9 Pro. Reportedly, this chipset will leverage Samsung’s latest 4nm manufacturing process, promising enhancements in power efficiency and thermal management.
According to a report from the Korean media outlet FNN, Google is poised to adopt Samsung Electronics’ 4-nanometer microprocessing foundry for the Tensor G4 chip integrated into the upcoming Pixel 9 series. The Tensor G4 chip is expected to utilize an innovative packaging technique known as Fan-out Wafer Level Packaging (FOWLP).
This packaging methodology is renowned for its ability to mitigate semiconductor heat dissipation while simultaneously augmenting power efficiency and overall performance. These advancements are anticipated to deliver significant strides over the preceding Tensor G3 SoC in terms of performance and efficiency.
Moreover, the report highlights Samsung’s successful implementation of the 4nm fabrication process in the Exynos 2400 chipsets featured in the Galaxy S24 and Galaxy S24+ models. These handsets reportedly garnered positive reception in the markets where they were introduced, signifying the efficacy and potential of the 4nm technology.
Google Pixel 8 and Pixel 8 Pro were launched in October last year with a Tensor G3 chipset and several AI-based features. A few short months after their release, we are seeing multiple leaks about the next-generation Pixel phones on the Web. Google’s next-generation SoC — Tensor G4 — is anticipated to power the Pixel 9 and Pixel 9 Pro. The chipset would be reportedly based on Samsung’s latest 4nm process and might offer improved power efficiency and heat management.
As per a report by Korean media outlet FNN, Google will apply Samsung Electronics’ foundry 4-nano microprocessing to the Tensor G4 chipset that will be installed in the upcoming Pixel 9 series. The Tensor G4 would reportedly use an advanced packing method called the FOWLP (Fan-out Wafer Level Packaging). This type of packaging is said to improve the heat generation of semiconductors and increase power efficiency and performance. This would offer notable improvements over last year’s Tensor G3 SoC.
Further, the report states that Samsung used the 4nm method in the Exynos 2400 chipsets of the Galaxy S24 and Galaxy S24+ models. The report claims that the handsets were well-received in the select markets they were launched.
