Google is gearing up to launch its Pixel 10 series later this year, featuring the next-generation Tensor G5 chipset. This new SoC is reportedly being developed in close collaboration with Taiwan Semiconductor Manufacturing Company (TSMC), continuing the strong partnership between the two firms. According to recent reports from China, Google intends to maintain this collaboration for several years, potentially through the Pixel 14 series, which could arrive as late as 2029.
The long-term partnership between Google and TSMC reflects a deepening relationship with Taiwan’s semiconductor industry. Sources indicate that Google executives recently visited TSMC’s headquarters in Taiwan to discuss expanding their cooperation. The discussions reportedly confirmed a multi-year agreement, ensuring that TSMC will remain the primary manufacturer for Google’s custom Tensor chips well into the future, at least for the next three to five years.
Beyond smartphones, Google’s collaboration with Taiwanese technology firms is expected to grow into other areas, including cloud-based TPU chips, integrated circuit (IC) design, server technology, and advanced liquid cooling solutions. The Pixel 10 series, expected to debut in late 2025, will showcase the first Tensor G5 chip made on TSMC’s advanced 3nm manufacturing process. The lineup is rumored to consist of four models: the Pixel 10, Pixel 10 Pro, Pixel 10 Pro XL, and Pixel 10 Pro Fold.
Leaks suggest that the Tensor G5 will bring significant improvements over its predecessor, the Tensor G4. Enhancements may include an always-on compute (AoC) audio processor, Google’s Emerald Hill memory co-processor, a custom DSP called Google GXP, and an EdgeTPU for AI acceleration. The chip is expected to use Arm Cortex CPU cores and feature a GPU designed by Imagination Technologies DXT, promising better performance and efficiency for Google’s upcoming flagship devices.