Micron Technology plans to invest $10 billion over the next decade in a new research facility in Boise, Idaho, focused on advanced memory technologies, computing systems and future semiconductor manufacturing.

The new Micron Research Labs facility will bring together customers, universities, government agencies and semiconductor partners to accelerate development of next-generation memory products.

The investment comes as demand for high-bandwidth memory (HBM) continues to surge due to rapid growth in AI data centers and advanced computing systems. HBM has become a critical component for feeding data to AI accelerators, benefiting major memory manufacturers including Micron, Samsung Electronics and SK Hynix.

Micron said the Boise facility will be connected with its global research network across the U.S., Europe, Japan, India, Singapore and Taiwan.

The project builds on more than $250 billion in separate U.S. manufacturing and R&D commitments already announced by the company. Micron expects construction of the new laboratory to begin in 2027, with the facility eventually hosting hundreds of researchers.