Huawei unveiled its long-term semiconductor strategy at the Huawei Connect conference in Shanghai, presenting detailed timelines for its Ascend AI chips, Kunpeng server processors, and next-generation computing systems. The move signals China’s determination to reduce reliance on foreign chipmakers like Nvidia while intensifying the U.S.-China tech rivalry.
Rotating chairman Eric Xu announced that Huawei will release new Ascend chips annually, doubling compute power with each iteration. The company launched its Ascend 910C earlier this year and plans to follow with the Ascend 950 in 2026, the 960 in 2027, and the 970 in 2028. Alongside, Huawei is preparing high-performance “supernodes” designed to interconnect thousands of chips at high speed. The Atlas 950 system, expected in late 2026, will link 8,192 Ascend chips, while the Atlas 960 in 2027 will support 15,488 chips—leaps over the existing Atlas 900.
Huawei also revealed it has developed proprietary high-bandwidth memory (HBM), a field dominated by South Korea’s SK Hynix and Samsung, strengthening its position in advanced computing. Updated versions of its Kunpeng server chip are scheduled for 2026 and 2028.
The timing of the announcement coincides with escalating tensions: Chinese regulators have accused Nvidia of antitrust violations and ordered local firms to halt purchases of its AI chips. Analysts say Huawei’s show of strength reflects growing confidence that U.S. export controls will not derail China’s domestic chipmaking progress.
Despite Huawei’s advances, engineers acknowledge Nvidia’s chips still outperform Chinese alternatives. However, Huawei is betting on leveraging China’s networking and power infrastructure advantages to offset manufacturing gaps and push large-scale systems forward.
Chinese semiconductor stocks rallied after reports of Beijing’s restrictions on Nvidia sales. The geopolitical backdrop looms large, with President Xi Jinping set to meet U.S. President Donald Trump amid renewed trade negotiations.